Back panel I/O ports
VGA (D-Sub) ports quantity:Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
6
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
2
BIOS
System Management BIOS (SMBIOS) version:
2.7
BIOS memory size:
256 Mbit
BIOS type:The BIOS (Basic Input/Output System) initializes and tests system hardware components, and loads a bootloader or an operating system from a mass memory device. The BIOS additionally provides abstraction layer for the hardware, i.e. a consistent way for application programs and operating systems to interact with the keyboard, display, and other input/output devices. There are several types of BIOS, including the motherboard ROM BIOS, video BIOS, drive controller BIOS, network adapter BIOS, and SCSI adapter BIOS.
AMI
Expansion slots
PCI Express x16 (Gen 3.x) slots:Places where PCI Express x16 (Gen 3.x) are placed inside and connected to the computer motherboard.
4
Features
Motherboard chipset:The chipset connects the microprocessor to the rest of the motherboard.
Intel® C621
Motherboard form factor:Design of the motherboard (ATX, BTX etc).
Extended ATX
Component for:What this product is used as a part of (component for).
Workstation
Internal I/O
Chassis intrusion connector:
Number of SATA III connectors:Serial ATA (Advanced Technology Attachment) (SATA) is a computer bus interface that connects host bus adapters to mass storage devices such as hard disk drives and optical drives. SATA III (revision 3.x) interface, formally known as SATA 6Gb/s, is a third generation SATA interface running at 6.0Gb/s. The bandwidth throughput, which is supported by the interface, is up to 600MB/s. This interface is backwards compatible with SATA 3 Gb/s interface.
8
Logistics data
Harmonized System (HS) code:
84733020
Memory
Supported memory clock speeds:Memory clock speed is the time it takes for a computer to complete basic operations. It refers to the computer's processing speed and is measured in hertz. It is however not such a reliable measure of a computer's speed as it doesn't take into account other factors like RAM and cache size.
2666,2933 MHz
Memory voltage:The voltage (V) of the memory in the device.
1.2 V
Supported memory types:Types of memory which can be used with the product.
DDR4-SDRAM
Network
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Ethernet interface type:
10 Gigabit Ethernet, Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Networking
Wi-Fi:Popular technology that allows an electronic device to exchange data or connect to the internet wirelessly using radio waves.
Ethernet interface type:
10 Gigabit Ethernet, Gigabit Ethernet
Ethernet LAN:An Ethernet LAN (Local Area Network) interface is present, for a wired conection via a cable.
Operational conditions
Operating relative humidity (H-H):
8 - 90%
Operating temperature (T-T):The minimum and maximum temperatures at which the product can be safely operated.
0 - 50 °C
Other features
Thermal Design Power (TDP):
205 W
Number of DIMM slots:The number of places where DIMMs can be connected. A DIMM or dual in-line memory module comprises a series of dynamic random-access memory integrated circuits. These modules are mounted on a printed circuit board and designed for use in personal computers, workstations and servers. DIMMs began to replace SIMMs (single in-line memory modules) as the predominant type of memory module as Intel P5-based Pentium processors began to gain market share.
12
PCI Express x8 (Gen 3.x) slots:Slots in the computer for PCI Express x8 (Gen 3.x), which is a high-speed serial computer expansion bus standard with 8 pins.
3
Processor
Processor number of cores supported:The quantity of processor cores which can be used in the device.
28
Compatible processor series:A processor which is compatible with this device, belongs to a 'series' which is part of 'family' e.g Celeron D, Celeron G, Celeron M, or, in some cases, is the same as 'family'.
Intel Xeon W
Processor socket:Mechanical component(s) that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the processor to be replaced without soldering.
LGA 3647 (Socket P)
Processor manufacturer:The manufacturer that produced the processor.
Intel
Rear panel I/O ports
VGA (D-Sub) ports quantity:Number of VGA (D-Sub) ports (connecting interfaces) in the device. The VGA (D-Sub) connector is a 15 pin connector between a computer and a monitor. It was first introduced in 1987 by IBM.
1
Ethernet LAN (RJ-45) ports:Number of Ethernet LAN (RJ-45) ports (connecting interfaces) in the device. Ethernet LAN (RJ-45) ports allow a computer to connect to the ethernet.
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity:
2
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity:
2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity:
6
USB 2.0 ports quantity:Number of USB 2.0 ports (connecting interfaces) in the device. USB 2.0 was released in April 2000 (now called "Hi-Speed"), adding higher maximum signaling rate of 480 Mbit/s (effective throughput up to 35 MB/s or 280 Mbit/s), USB 2.0 ports are usually black.
2
Storage controllers
RAID levels:RAID is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
0, 1, 5, 10
RAID support:The device uses RAID, which is a storage technology that combines multiple disk drive components into a logical unit for the purposes of data redundancy and performance improvement. Data is distributed across the drives in one of several ways, referred to as RAID levels, depending on the specific level of redundancy and performance required.
Technical details
Sustainability certificates:
RoHS
Weight & dimensions
Depth:The distance from the front to the back of something.
330.2 mm
Width:The measurement or extent of something from side to side.
304.8 mm
